AMAT · News · 20261001N

Advanced Packaging Strategic Expansion

APPLIED MATERIALS INC /DE · 2026-10-01 · Importance 31 · Surprise 42 · In source text

Applied Materials and BE Semiconductor Industries (Besi) expanded their strategic partnership on October 1, 2026, with Besi joining Applied’s EPIC Center as an Innovation Partner. The collaboration targets next-generation 3D integrated-circuit scaling, logic and memory integration, and photonics applications supporting AI infrastructure build-out. Development will extend beyond die-to-wafer hybrid bonding to hybrid-bonding platforms, thermo-compression bonding, and die-on-wafer, die-on-die, and die-on-panel architectures. Applied’s EPIC Center is expected to be operationally ready in 2026, with the partnership intended to accelerate advanced-packaging technologies from research into high-volume manufacturing.

Key facts

• Applied's EPIC Center is expected to be operationally ready in 2026. source
• Besi joins Applied's EPIC Center as an Innovation Partner. source
• Applied Materials expanded its partnership with BE Semiconductor Industries (Besi) to develop advanced packaging technologies for AI infrastructure. source
• The expanded collaboration targets next-generation 3D IC scaling, logic and memory integration, and photonics applications supporting AI infrastructure build-out. source
• Partnership expands beyond die-to-wafer hybrid bonding to new hybrid bonding platforms, scaling of thermo-compression bonding (TCB), and new die-on-wafer, die-on-die and die-on-panel architectures. source
• The collaboration aims to develop higher-density and higher-bandwidth connections essential for complex AI systems. source
• The initiative seeks to accelerate the transition of semiconductor technologies from research to high-volume manufacturing. source
• The collaboration focuses on thermo-compression bonding and photonics technologies as part of advanced packaging work. source

Impact estimates