AMAT · News · 20261006N

AI Chip Partnerships

APPLIED MATERIALS INC /DE · 2026-10-06 · Importance 31 · Surprise 42 · In source text

Applied Materials and Intel are collaborating on next-generation transistor, interconnect, and advanced-packaging technologies for AI chips and systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Intel’s R&D campus in Oregon. The collaboration is intended to shorten development cycles and accelerate the transition of semiconductor technologies from research into high-volume manufacturing, including 3D chip-stacking applications such as Intel’s Foveros platform.

Key facts

• Applied Materials announced it is working with Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies. source
• The joint effort will involve work at Applied Materials' EPIC Center in Silicon Valley and Intel's research campus in Hillsboro, Oregon, with the goal to shorten development cycles and accelerate the path from research to high-volume manufacturing for AI workloads. source
• Collaborations at Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Oregon aim to develop breakthroughs in next-generation transistors, interconnects and advanced packaging technologies for AI chips and systems. source
• The collaboration will focus on transistors, interconnects, and advanced packaging technologies, including Foveros-based 3D stacking. source

Impact estimates