AMAT · News · 20261007N

Intel Foundry Partnership

APPLIED MATERIALS INC /DE · 2026-10-07 · Importance 31 · Surprise 42 · In source text

Applied Materials and Intel are partnering on next-generation semiconductor manufacturing technologies for high-performance computing and artificial-intelligence platforms. Intel will join Applied Materials’ EPIC Center as a founding partner, alongside Samsung Electronics and TSMC, with the facility scheduled to open on October 12, 2026. The collaboration covers advanced logic processes, next-generation transistors, interconnect scaling, device architectures, materials and process technologies, and Intel’s Foveros-based 3D-stacking packaging. Work will be conducted at Intel’s Oregon R&D campus and Applied Materials’ EPIC Center in Silicon Valley to shorten development cycles and accelerate U.S. technology deployment.

Key facts

• The EPIC Center, a joint R&D facility in Silicon Valley, is scheduled to open on October 12th. source
• The collaboration aims to accelerate innovation in process technologies and equipment for high-performance computing (HPC) and artificial intelligence (AI) platforms, focusing on advanced logic processes, device architectures, and Foveros-based 3D-stacking packaging. source
• Work for the Applied Materials and Intel partnership will be conducted at Intel's R&D campus in Oregon and Applied Materials' new EPIC Center in Silicon Valley. source
• The partnership is expected to shorten development cycles and accelerate the introduction of new technologies to the market. source
• The joint effort focuses on materials, process technologies, device architectures for AI workloads, and advanced packaging for 3D stacking. source

Impact estimates