AMAT · News · 20261013N
Acquisitions and Partnerships
APPLIED MATERIALS INC /DE · 2026-10-13 · Importance 31 · Surprise 42 · In source text
Applied Materials expanded collaboration with Intel on next-generation transistors, interconnects, and chip packaging. Packaging-equipment specialist Besi also expanded its longstanding collaboration with Applied Materials. The partnerships support development and commercialization of equipment and processes for leading-edge foundry-logic, DRAM, and advanced-packaging applications. Applied Materials also opened the EPIC Center to bring chipmakers, system companies, equipment suppliers, and academic researchers into a shared development environment.
Key facts
- Intel agreed to work with Applied Materials on next-generation transistors, interconnects, and chip packaging. source
Impact estimates
| metric | direction | stage | expected | basis |
|---|---|---|---|---|
| revenue | positive | probable | — | Intel agreed to work with Applied Materials on next-generation transistors, interconnects, and chip packaging. |