AMAT · 8-K · 20261026PR067303

EPIC Partner Ecosystem Expansion

APPLIED MATERIALS INC /DE · 2026-10-26 · Importance 23 · Surprise 24

Applied Materials and BE Semiconductor Industries (Besi) expanded their collaboration, which began in 2020, with Besi joining Applied’s EPIC Center as an Innovation Partner. The collaboration extends beyond hybrid bonding into new interconnect architectures and applications supporting semiconductor AI scaling. Areas include next-generation 3D IC scaling, logic and memory integration, scaling thermo-compression bonding, and die-on-wafer, die-on-die and die-on-panel integration platforms.

Key facts

• Besi joined Applied Materials’ EPIC Center as an Innovation Partner. source
• Applied Materials and Besi expanded their co-innovation beyond hybrid bonding into new interconnect architectures and applications supporting the semiconductor industry’s AI-driven scaling roadmap. source
• Applied Materials and Besi’s collaboration includes next-generation 3D IC scaling, logic and memory integration, scaling of thermo-compression bonding, and new die-on-wafer, die-on-die and die-on-panel integration platforms. source