AVGO · News · 20260725N

Samsung AI Chip Partnership

Broadcom Inc. · 2026-07-25 · Importance 64 · Surprise 42 · In source text

Samsung Electronics secured a Broadcom partnership valued at more than $200 billion through 2030 covering memory, contract manufacturing, and advanced packaging for AI chips. Samsung is expected to supply high-bandwidth memory and manufacture Broadcom’s next-generation communication chips using sub-2-nanometer process technology. The collaboration is intended to support Broadcom’s AI accelerators and networking silicon while improving Samsung’s foundry utilization and positioning in AI infrastructure. Reports indicate Samsung will provide the bulk of Broadcom’s memory requirements through 2030.

Key facts

• Samsung Electronics has secured a partnership with Broadcom valued at over $200 billion until 2030 covering memory chips, contract chip making, and advanced packaging for AI chips. source
• The agreement includes manufacturing Broadcom's next-generation communication chips using Samsung's sub-2-nanometer process technology. source
• The Samsung-Broadcom collaboration includes joint work on high-bandwidth memory products. source

Impact estimates