CSCO · News · 20261019N
AI Networking Product Launch
CISCO SYSTEMS, INC. · 2026-10-19 · Importance 34 · Surprise 42 · In source text
Cisco unveiled AI networking platforms based on its Silicon One P200, G300 and G302 switching chips. The platforms include 51.2T and 102.4T systems, 1.6T optical modules, and integrated liquid cooling for high-density AI data-center deployments. Cisco is collaborating with NVIDIA, TE Connectivity, and Amphenol on a 400Gb/s-per-lane USFP optical module and open specification. The launch strengthens Cisco’s positioning in AI infrastructure networking and optical connectivity.
Key facts
- Cisco Systems announced new AI networking platforms using Silicon One P200, G300 and G302 switching chips with 51.2T and 102.4T systems. source
- Cisco introduced 1.6T optical modules and integrated liquid cooling aimed at high density AI data center deployments. source
- Cisco disclosed a collaboration with NVIDIA, TE Connectivity and Amphenol to co develop a 400Gb/s per lane USFP optical module and open specification. source
Impact estimates
| metric | direction | stage | expected | basis |
|---|---|---|---|---|
| revenue | positive | probable | — | Cisco Systems announced new AI networking platforms using Silicon One P200, G300 and G302 switching chips with 51.2T and 102.4T systems. |
| revenue | positive | probable | — | Cisco introduced 1.6T optical modules and integrated liquid cooling aimed at high density AI data center deployments. |
| revenue | positive | probable | — | Cisco disclosed a collaboration with NVIDIA, TE Connectivity and Amphenol to co develop a 400Gb/s per lane USFP optical module and open… |