INTC · 10-K · 2025A · Full report

Disaggregated Architecture Strategy

INTEL CORP · 2026-01-23 · Importance 52 · Surprise 42

Intel has adopted a disaggregated chiplet/tile architecture across newer and higher-end products including Intel Core Ultra and server CPUs to enable design flexibility and yield advantages. The approach allows each tile to be manufactured on the most appropriate process node, but introduces complexity in advanced packaging, substrates and increased costs relative to monolithic architectures. Intel acknowledges increased manufacturing challenges when supply for advanced substrates and materials is constrained. The company has also used third-party foundries, including TSMC, for certain tiles or whole products where advantageous for cost, performance or schedule and expects continued third-party foundry use for key tiles in current and future products.

Key facts

• Intel has adopted a disaggregated design architecture for most newer and higher-end products, including all current Intel Core Ultra products and server CPUs.
• Intel reported the semiconductor foundry market in 2025 was shaped by rapid growth in AI and high-performance computing workloads driving demand for disaggregated architectures built on interconnected chiplets and advanced packaging.