INTC · 10-K · 2025A · Full report

Packaging Technology

INTEL CORP · 2026-01-23 · Importance 50 · Surprise 42

Intel is investing in advanced packaging technologies to support disaggregated architectures, including EMIB, EMIB-T (introduced 2025, expected adoption scaling in 2026) and multiple Foveros variants (Foveros‑B and Foveros‑R targeted for high-volume manufacturing in 2027, Foveros‑S for high-speed I/O disaggregation). The company introduced EMIB‑T to improve power delivery and bandwidth scalability for larger package formats and next-generation memory. Intel continued development of Foveros Direct in 2025 with hybrid‑bonding support planned on Intel 18A‑PT in 2028 to enable higher interconnect density and lower energy usage. Packaging is positioned as a key enabler for both internal products and external foundry customers requiring advanced package integration.

Key facts

• Intel reported Intel Core Ultra Series 2 features the first implementation of an NPU and Foveros advanced packaging technologies in desktop microprocessors and manufacturing of Series 2 products is performed by Intel Foundry using Intel 3 process technology or by an external foundry depending on the version.
• Intel stated Intel Xeon 6 compute dies are manufactured using Intel 3 process technology while the I/O dies are manufactured on Intel 7 and connected in a single package utilizing EMIB technology.
• EMIB entered high-volume manufacturing in 2017 and Intel introduced EMIB-T in 2025, with adoption of EMIB-T expected to scale beginning in 2026.
• Intel continued to invest in Foveros, first introduced in 2019, and expanded Foveros to include Foveros-B and Foveros-R targeted for high-volume manufacturing in 2027.
• Intel continued development of Foveros Direct, announced in 2025, with hybrid-bonding support planned on Intel 18A-PT in 2028.

Impact estimates