MU · 10-K · 2026A · Full report
Manufacturing Capacity Expansion
MICRON TECHNOLOGY INC · 2026-10-09 · Importance 37 · Surprise 42 · In source text
Micron expects to add DRAM wafer capacity to support projected memory demand in the second half of the decade and beyond while maintaining stable bit share. Its U.S. expansion includes leading-edge fabs in Boise, Idaho, and up to four fabs in Clay, New York, with initial wafer output projected for mid-2027, late 2028, and 2030, respectively. Internationally, Micron is expanding assembly and test capacity in Gujarat, modernizing Hiroshima, adding HBM packaging and NAND cleanroom capacity in Singapore, and expanding DRAM and HBM production in Taiwan. The Tongluo facility acquired from Powerchip is expected to support meaningful shipments from its existing fab beginning in mid-2027, with a second cleanroom under construction.
Key facts
- In June 2025 Micron announced plans for a second leading-edge memory manufacturing fab in Idaho; construction activities for the second Idaho fab began in 2026 and Micron expects initial wafer output by late calendar 2028. source
- Micron broke ground in July 2026 on a new cleanroom project at its Hiroshima, Japan manufacturing facility, expected initial output in late calendar 2028. source
- Micron broke ground in January 2025 on an HBM advanced packaging facility in Singapore to expand advanced packaging capacity beginning in early calendar 2027 and in January 2026 broke ground on an additional advanced wafer fab facility in Singapore expected to be operational in the second half of calendar 2028. source
- Micron expects the acquired Taiwan site to support meaningful product shipments beginning in mid-calendar 2027 and has begun construction of a similar-sized second cleanroom at this site. source
- Micron stated it will need to add new DRAM wafer capacity to support projected memory demand in the second half of the decade and beyond, in addition to bit density improvements per wafer. source
- India assembly and test facility in Gujarat commenced commercial shipments and started ramping production in 2026. source
Impact estimates
| metric | direction | stage | expected | basis |
|---|---|---|---|---|
| assets | positive | committed | — | In June 2025 Micron announced plans for a second leading-edge memory manufacturing fab in Idaho; construction activities for the second… |
| revenue | positive | probable | — | In June 2025 Micron announced plans for a second leading-edge memory manufacturing fab in Idaho; construction activities for the second… |
| assets | positive | committed | — | Micron broke ground in July 2026 on a new cleanroom project at its Hiroshima, Japan manufacturing facility, expected initial output in… |
| revenue | positive | probable | — | Micron broke ground in July 2026 on a new cleanroom project at its Hiroshima, Japan manufacturing facility, expected initial output in… |
| assets | positive | committed | — | Micron broke ground in January 2025 on an HBM advanced packaging facility in Singapore to expand advanced packaging capacity beginning in… |
| revenue | positive | probable | — | Micron broke ground in January 2025 on an HBM advanced packaging facility in Singapore to expand advanced packaging capacity beginning in… |
| revenue | positive | probable | — | Micron broke ground in January 2025 on an HBM advanced packaging facility in Singapore to expand advanced packaging capacity beginning in… |
| revenue | positive | probable | — | Micron expects the acquired Taiwan site to support meaningful product shipments beginning in mid-calendar 2027 and has begun construction… |
| assets | positive | committed | — | Micron expects the acquired Taiwan site to support meaningful product shipments beginning in mid-calendar 2027 and has begun construction… |
| assets | positive | contingent | — | Micron stated it will need to add new DRAM wafer capacity to support projected memory demand in the second half of the decade and beyond,… |