MU · 10-Q · 2026Q2 · Full report

Manufacturing Capacity Expansion

MICRON TECHNOLOGY INC · 2026-06-25 · Importance 37 · Surprise 42 · In source text

Micron plans to begin construction of a second leading-edge DRAM fab in Idaho in 2026, with initial wafer output expected by late calendar 2028, while the first Boise fab is projected to produce its first DRAM wafers in mid-calendar 2027. The company broke ground on its first New York fab in January 2026 and expects that site to provide supply beginning in 2030 and beyond. Singapore’s HBM advanced-packaging facility is expected to expand capacity beginning in the first half of calendar 2027, and its additional NAND wafer-fab facility is expected to provide cleanroom space in the second half of calendar 2028. In March 2026, Micron acquired a wafer-fabrication facility in Tongluo, Taiwan, from Powerchip Semiconductor Manufacturing Corporation for $1.8 billion, with meaningful shipments expected from the existing fab beginning in mid-calendar 2027.

Key facts

Impact estimates

metricdirectionstageexpectedbasis
revenuepositiveprobable—Micron announced plans in June 2025 for a second leading-edge memory manufacturing fab in Idaho, plans to begin construction in 2026, and…
revenuepositiveprobable—Micron expects initial meaningful product shipments from the Tongluo, Taiwan acquired site beginning in mid-calendar 2027.
assetspositiveprobable—Micron estimates it will need to add new DRAM wafer capacity to support projected memory demand in the second half of the decade and beyond.
cashnegativeprobable—Micron estimates it will need to add new DRAM wafer capacity to support projected memory demand in the second half of the decade and beyond.
revenuepositiveprobable—Micron estimates it will need to add new DRAM wafer capacity to support projected memory demand in the second half of the decade and beyond.