QCOM · News · 20260921N

AI Infrastructure Partnership

QUALCOMM INC/DE · 2026-09-21 · Importance 31 · Surprise 42

Qualcomm Technologies is collaborating with Lumentum and Corning to demonstrate a high-density 1060 nm VCSEL optical die-to-die interconnect at ECOC 2026 in Málaga, Spain. The architecture combines Qualcomm’s D2D interface subsystem, Lumentum’s optical interconnect platform, and Corning’s multimode fiber. The initiative targets AI scale-up and horizontal-scaling architectures by providing high-bandwidth, low-power, low-latency connectivity, supporting Qualcomm’s strategic expansion beyond handset-focused markets into AI infrastructure.

Key facts

• Qualcomm Technologies will jointly demonstrate a high-density die-to-die (D2D) optical interconnect for AI scale-up architectures at ECOC 2026 in Málaga, Spain. source
• Qualcomm, Lumentum, and Corning are collaborating to demonstrate advanced optical interconnect solutions for AI horizontal scaling architectures. source
• The demonstration is described as showcasing a massively parallel optical D2D architecture capable of extending high-bandwidth, low-power, low-latency connectivity over multimode fiber. source
• Qualcomm surged 7% after demonstrating an AI die-to-die optical interconnect with Lumentum and Corning. source
• Qualcomm experienced a significant intraday jump of nearly 6%, reaching $190.91. source
• Qualcomm surged 7.6% after hours, adding approximately $15 billion in market value and reaching $194.23 per share. source
• Qualcomm shares (QCOM) rose more than 8% on Monday. source
• The demonstration will feature Qualcomm's D2D interface subsystem. source